Die attachment, wire bonding, and encapsulation
A bonding method using n-ohmic contact-treatment is proposed, and it is found that GaN-based blue vertical light emitting diode (VLED) using the proposed bonding method provides average light output power (386.6 mW). This bonding technique shows excellent potential for high- temperature packing applications. Au-wire bonding in white LEDs on the angular uniformity of correlated color temperature …
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